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PIC18F4680T-I/PT

Microchip Technology

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pedido mínimo: 300

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PIC18F4680-I/PT

Name: PIC18F4680-I/PT
Brand: Microchip Technology
SKU: 44803771
Price: 58.95 USD
Availability: InStock

Microchip Technology

MCU 8-bit - Flash - PIC18 Family PIC18F46xx Series Microcontrollers - 40 MHz - 64 KB - 3.3 KB - 44 Pins.

FICHA TÉCNICA Accesorios Notificarme

Cumple con RoHS

TRAY embalaje

Certificate of Compliance Guarantee

Este producto puede requerir documentación adicional. El envío puede retrasarse de 1 a 2 días.

Descripción +

MCU 8-bit - Flash - PIC18 Family PIC18F46xx Series Microcontrollers - 40 MHz - 64 KB - 3.3 KB - 44 Pins.

Palabras clave de búsqueda: PIC18F4680IPT

Especificaciones +

Atributo del producto

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Proveedor:

Microchip Technology
Nº de pieza:

PIC18F4680-I/PT
Unidad de medida:

Por Each
RoHS:

Yes
HTS:

8542310015
COO:

TH
ECCN:

3A991.a.2
Paquete estándar del proveedor:

160
Program Memory Size:

64 KB
Number of Programmable I/Os:

44
Program Memory Type:

Flash
Operating Temperature:

-25 to 85 °C
RAM Size:

3.25 KB
ADC Resolution:

10 bit

Tools/3D Models +

Caja de herramientas EE

Guías de productos +

FICHA TÉCNICA

Learn more about Microchip Technology Top Selling Microcontrollers and Microprocessors

Product Changes +

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 06-Mar-2006 - Product Change Notice

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 11-Nov-2004 - Product Change Notice

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB

PCN - 09-Feb-2006 - Product Change Notice

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 01-Dec-2005 - Product Change Notice

PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 08-Mar-2007 - Product Change Notice

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

Product Change Notification

Este producto está descontinuado, pero aún está disponible.
Este producto NO cumple con RoHS. Ver alternativa
Diferentes opciones de productos disponibles. Ver alternativa
Diferentes opciones de embalaje disponibles. Ver alternativa
Posibles opciones de reemplazo disponibles. Ver alternativa
Item discontinued
Fin del ciclo de vida: Los pedidos finales deben realizarse antes de
Item discontinued

En stock: 1.093

Buques today, Si realiza un pedido en

Stock del fabricante:

17.838 puede enviar 6/19/26

Cantidad mínima de pedido:

Plazo de entrega de fábrica:

4 Weeks puede enviar 2/7/26

Precio (USD)

Qty

Precio por unidad

$11.79

$10.68

$10.39

160

$9.75

320

$9.73

640

$9.63

1.120 +

$9.61

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