Available Replacements

Alternative Packaging

PIC18F1320T-I/SS

Microchip Technology

En stock: 0

pedido mínimo: 400

VIEW PRODUCT

La imagen es representativa - ver especificaciones del fabricante

PIC18F1320-I/SS

Name: PIC18F1320-I/SS
Brand: Microchip Technology
SKU: 44800893
Price: 22.9 USD
Availability: InStock

Microchip Technology

MCU 8-bit PIC RISC 8KB Flash 5V 20-Pin SSOP Tube

FICHA TÉCNICA Accesorios Notificarme

Cumple con RoHS

TUBE embalaje

Certificate of Compliance Guarantee

Descripción +

MCU 8-bit PIC RISC 8KB Flash 5V 20-Pin SSOP Tube

Palabras clave de búsqueda: PIC18F1320ISS

Especificaciones +

Atributo del producto

Valor de atributo Seleccionar atributo
Productos Encontrados: 0 Mostrar similares
Proveedor:

Microchip Technology
Nº de pieza:

PIC18F1320-I/SS
Unidad de medida:

Por Each
RoHS:

Yes
HTS:

8542310015
COO:

TH
ECCN:

EAR99
Paquete estándar del proveedor:

67
ADC Resolution:

10 bit
RAM Size:

256 B
Operating Temperature:

-40 to 85 °C
Program Memory Size:

8 KB
Program Memory Type:

Flash
Number of Programmable I/Os:

16

Tools/3D Models +

Caja de herramientas EE

Guías de productos +

FICHA TÉCNICA

Product Changes +

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

PCN - 07-Oct-2005 - Product Change Notice

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 06-Mar-2006 - Product Change Notice

PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300

PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 11-Nov-2004 - Product Change Notice

PCN - 12-Mar-2003 - FIRMWARE CHANGE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

Este producto está descontinuado, pero aún está disponible.
Este producto NO cumple con RoHS. Ver alternativa
Diferentes opciones de productos disponibles. Ver alternativa
Diferentes opciones de embalaje disponibles. Ver alternativa
Posibles opciones de reemplazo disponibles. Ver alternativa
Item discontinued
Fin del ciclo de vida: Los pedidos finales deben realizarse antes de
Item discontinued

En stock: 202

Buques today, Si realiza un pedido en

Stock del fabricante:

314 puede enviar 6/12/26

Cantidad mínima de pedido:

Plazo de entrega de fábrica:

5 Weeks puede enviar 6/7/26

Precio (USD)

Qty

Precio por unidad

$4.58

$4.21

134

$4.04

268

$3.94

536

$3.79

1.005

$3.78

2.546

$3.74

5.025 +

$3.70

Suppliers Standard Package

Inicia sesión Para desbloquear precios especiales

CLIENTELA TAMBIÉN COMPRADO

320.02E11.08BLK

Tactile Switch - SPST NO - 50VDC - 25mA - 135 (+/-) 50 gf - Black Button - Through Hole

1792249

PCB connector - nominal current: 12 A - rated voltage (III/2): 320 V - nominal cross secti...

PIC18F1320-I/SS

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

PIC18F1320-I/SS

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

Join the circuit, Keeping You Connected to OnlineComponents.com & Beyond!