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MCP2551-E/SN

Microchip Technology

En stock: 0

pedido mínimo: 100

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MCP2551T-E/SN

Microchip Technology

CANBus Tranceiver - 1Mbps - Sleep/Standby - 5V - 8-Pin.

FICHA TÉCNICA Accesorios Notificarme

Cumple con RoHS

Terminado

REEL embalaje

Certificate of Compliance Guarantee

Descripción +

CANBus Tranceiver - 1Mbps - Sleep/Standby - 5V - 8-Pin.

Palabras clave de búsqueda: MCP2551TESN

Especificaciones +

Atributo del producto

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Proveedor:

Microchip Technology
Nº de pieza:

MCP2551T-E/SN
Unidad de medida:

Por Each
RoHS:

Yes
HTS:

8542390090
COO:

TH
ECCN:

EAR99
Reel Pack:

1
Category:

Transceiver
Dimension:

4.9 x 3.9 x 1.25(Min) mm

Tools/3D Models +

Caja de herramientas EE

Guías de productos +

FICHA TÉCNICA

Product Changes +

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 11-Nov-2004 - Product Change Notice

PCN - 10-Jul-2010 - Microchip has released a new DeviceDoc for the MCP2551 Datasheet of devices.

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 09-Sep-2009 - QUALIFICATION OF NEW WAFER FAB FOUNDRY

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 22-Jan-2009 - Microchip is qualifying the new wafer fab foundry for MCP1790,MCP200x and MCP2551 products in order

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 22-Jan-2004 - Product Change Notice

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 28-Jun-2005 - Product Change Notice

PCN - 26-May-2005 - Product Change Notice

PCN - 17-Nov-2009 - Microchip is qualifying a new wafer fab foundry for listed products in order to improve production c

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

Product Change Notification

Este producto está descontinuado, pero aún está disponible.
Este producto NO cumple con RoHS. Ver alternativa
Diferentes opciones de productos disponibles. Ver alternativa
Diferentes opciones de embalaje disponibles. Ver alternativa
Posibles opciones de reemplazo disponibles. Ver alternativa
Item discontinued
Fin del ciclo de vida: Los pedidos finales deben realizarse antes de 10/31/2024
Item discontinued

En stock: 0

Stock del fabricante:

55 puede enviar 5/29/26

Cantidad mínima de pedido:

250

Precio (USD)

Qty

Precio por unidad

$1.4234

250

$1.2940

500

$1.2750

1.000

$1.2560

3.300

$1.2440

6.600

$1.2380

9.900 +

$1.2310

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MCP2551T-E/SN

Microchip Technology

Precio (USD)

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