DSPIC33EP512MU810-I/PF by microchip technology

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DSPIC33EP512MU810-I/PF

Microchip Technology

MCU - 16-bit dsPIC - 536KB Flash - 52KB RAM - -40°C to +85°C - 3.3V - 100-Pin TQFP - Tray

FICHA TÉCNICA Accesorios Notificarme

Cumple con RoHS

TRAY embalaje

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Este producto puede requerir documentación adicional. El envío puede retrasarse de 1 a 2 días.

Descripción +

MCU - 16-bit dsPIC - 536KB Flash - 52KB RAM - -40°C to +85°C - 3.3V - 100-Pin TQFP - Tray

Palabras clave de búsqueda: DSPIC33EP512MU810IPF

Especificaciones +

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Proveedor:

Microchip Technology
Nº de pieza:

DSPIC33EP512MU810-I/PF
Unidad de medida:

Por Each
RoHS:

Yes
HTS:

8542310020
COO:

TW
ECCN:

3A991.a.2
Paquete estándar del proveedor:

90
RAM Size:

52 KB
Program Memory Size:

536 KB
Operating Temperature:

-40 to 85 °C
Number of Programmable I/Os:

83
Program Memory Type:

Flash
ADC Resolution:

12/12 bit

Tools/3D Models +

Caja de herramientas EE

Guías de productos +

FICHA TÉCNICA

Product Changes +

PCN - 04-Nov-2015 - ERRATA-DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION

PCN - 15-Jan-2014 - Microchip is announcing the qualification of the listed 100L TQFP (14x14x1mm) package products with

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 18-Oct-2012 - Microchip has released a new devicedoc for the dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/G

PCN - 25-Aug-2017 - UPDATED SILICON ISSUE 3 (CPU) AND 28 (CPU) 2) ADDED SILICON ISSUE 39 (CPU)

PCN - 27-Mar-2019 - CORRECTED THE ESTIMATED FIRST SHIP DATE YEAR FOR 100L TQFP FROM 2018 TO 2019

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 03-Aug-2011 - Microchip has released a new devicedoc for the listed dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/

PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 21-Dec-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 22-Nov-2011 - DSPIC33EPXXXMU8XX AND PIC24EPXXXGU81X ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION

PCN - 04-Nov-2015 - ERRATA-DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION

PCN - 18-Oct-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DOCUMENT REVISION

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 18-Oct-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DOCUMENT REVISION

PCN - 25-Oct-2019 - ERRATA - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 18-Aug-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE

PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH GOLD (AU) WIRE AT ASE ASSEMBLY SITE

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE

PCN - 08-Mar-2019 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 25-Aug-2017 - UPDATED SILICON ISSUE 3 (CPU) AND 28 (CPU) 2) ADDED SILICON ISSUE 39 (CPU)

PCN - 27-Feb-2012 - Microchip has released a new devicedoc for the listed dsPIC33EPXXX(GP/MC/MU)806/810/8 4 and PIC24EPX

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 27-Feb-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DATA SHEET

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 10-Aug-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE

PCN - 02-Aug-2019 - FINAL NOTICE IMPLEMENT NEW PACKING MATERIAL

PCN - 11-Dec-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 30-Aug-2011 - Microchip has released a new devicedoc for the listed MCP621/2/4/5/9 data sheet of devices in order

PCN - 25-Jul-2014 - QUALIFICATION OF ASE ASSEMBLY SITE FOR 100L TQFP (14X14X1MM) PACKAGE WITH GOLD (AU) WIRE

PCN - 30-Mar-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION

PCN - 15-Jan-2014 - Microchip is announcing the qualification of the listed 100L TQFP (14x14x1mm) package products with

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

Este producto está descontinuado, pero aún está disponible.
Este producto NO cumple con RoHS. Ver alternativa
Diferentes opciones de productos disponibles. Ver alternativa
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Item discontinued
Fin del ciclo de vida: Los pedidos finales deben realizarse antes de
Item discontinued

En stock: 101

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Plazo de entrega de fábrica:

20 Weeks puede enviar 14/9/26

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$16.17

$12.36

$11.22

180

$10.59

270 +

$10.54

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DSPIC33EP512MU810-I/PF

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

DSPIC33EP512MU810-I/PF

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

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