Available Replacements

Alternative Packaging

25LC512T-I/SN

Microchip Technology

En stock: 5.727

pedido mínimo: 100

VIEW PRODUCT

La imagen es representativa - ver especificaciones del fabricante

25LC512-I/SN

Name: 25LC512-I/SN
Brand: Microchip Technology
SKU: 44803404
Price: 242 USD
Availability: InStock

Microchip Technology

EEPROM - Serial SPI - 512Kb (64K x 8) - 3.3V/5V - 20 MHz - 8 Pin SOIC - Tube

FICHA TÉCNICA Accesorios Notificarme

Cumple con RoHS

TUBE embalaje

Certificate of Compliance Guarantee

Este producto puede requerir documentación adicional. El envío puede retrasarse de 1 a 2 días.

Descripción +

EEPROM - Serial SPI - 512Kb (64K x 8) - 3.3V/5V - 20 MHz - 8 Pin SOIC - Tube

Palabras clave de búsqueda: 25LC512ISN

Especificaciones +

Atributo del producto

Valor de atributo Seleccionar atributo
Productos Encontrados: 0 Mostrar similares
Proveedor:

Microchip Technology
Nº de pieza:

25LC512-I/SN
Unidad de medida:

Por Each
RoHS:

Yes
HTS:

8542320051
COO:

TH
ECCN:

3A991.b.1.b.2
Paquete estándar del proveedor:

100
Data Retention:

200(Min) Year

Tools/3D Models +

Caja de herramientas EE

Guías de productos +

FICHA TÉCNICA

Product Changes +

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 24-May-2010 - Microchip has released a new DeviceDoc for the 25LC512 data sheet of devices.

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 24-May-2010 - DATA SHEET-25LC512 DATA SHEET

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 15-Jun-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 04-Mar-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

Este producto está descontinuado, pero aún está disponible.
Este producto NO cumple con RoHS. Ver alternativa
Diferentes opciones de productos disponibles. Ver alternativa
Diferentes opciones de embalaje disponibles. Ver alternativa
Posibles opciones de reemplazo disponibles. Ver alternativa
Item discontinued
Fin del ciclo de vida: Los pedidos finales deben realizarse antes de
Item discontinued

En stock: 1.210

Buques today, Si realiza un pedido en

Cantidad mínima de pedido:

100

Incremento de pedidos:

100

Plazo de entrega de fábrica:

8 Weeks puede enviar 29/7/26

Precio (USD)

Qty

Precio por unidad

100

$2.42

300

$2.38

500

$2.37

1.000

$2.36

2.500

$2.35

5.000

$2.34

7.500

$2.33

10.000 +

$2.32

Suppliers Standard Package

Inicia sesión Para desbloquear precios especiales

25LC512-I/SN

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

25LC512-I/SN

Microchip Technology

Precio (USD)

Standard Packaging

Reel Packaging

Join the circuit, Keeping You Connected to OnlineComponents.com & Beyond!