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30 MODII HDR SRST UNSHRD STKG

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Description +
30 MODII HDR SRST UNSHRD STKG
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SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    3-146468-0
  • Unit of Measure:
    Per Each
  • RoHS:
    No
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    150
  • Stack Height:
    .8 in, 20.32 mm
  • PCB Mount Orientation:
    Vertical
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Contact Layout:
    Inline
  • Contact Type:
    Pin
  • Insulation Resistance:
    5000 MΩ
  • Stackable:
    Yes
  • Number of Rows:
    1
  • Housing Material:
    Thermoplastic
  • Contact Current Rating (Max):
    3 A
  • PCB Mount Retention:
    Without
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • Contact Mating Area Plating Material:
    Tin-Lead
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • Contact Mating Area Plating Material Finish:
    Bright
  • UL Flammability Rating:
    UL 94V-0
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Approved Standards:
    CSA LR7189 , UL E28476
  • Number of Positions:
    30
  • Contact Mating Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Contact Shape & Form:
    Square
  • PCB Contact Termination Area Plating Material Finish:
    Bright
  • Agency/Standard:
    CSA , UL
  • PCB Thickness (Recommended):
    .062 in, 1.57 mm
  • Termination Post & Tail Length:
    .12 in, 3.05 mm
  • Contact Underplating Material:
    Nickel
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Packaging Type:
    Package
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Primary Product Color:
    Black
  • Contact Underplating Material Thickness:
    50 µin, 1.27 µm
  • Connector Mounting Type:
    Board Mount
  • Circuit Application:
    Signal
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Sealable:
    No
  • Connector System:
    Board-to-Board
  • PCB Mount Alignment:
    Without
  • Contact Mating Area Length:
    .109 in, 2.79 mm
  • Board-to-Board Configuration:
    Parallel
  • Contact Base Material:
    Copper Alloy
  • Mating Alignment:
    Without
  • Header Type:
    Breakaway
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
Tools/3D Models +
Price Match Guarantee
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In Stock: 0
MOQ for out of Stock Qty:
750
9 Weeks can ship 7/10/26
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Price (USD)
Qty
Unit Price
750
$14.97
1,500
$7.65
2,250
$5.21
3,000 +
$5.10
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