2823403-5

TE Connectivity / AMP Brand

5P,2MM,PL HDR,SRRT,2.8,SN,TB

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RoHS Compliant

Tube Packaging

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Description +

5P,2MM,PL HDR,SRRT,2.8,SN,TB

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Potential Applications:

Search Keywords: 28234035

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Product Attribute

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Supplier:

TE Connectivity / AMP Brand
Part No:

2823403-5
Alias/AKA:

2MM-HSP-S05-HT-02-T-TB
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8536694040
COO:

CN
ECCN:

EAR99
Supplier Standard Pack:

45
Contact Mating Area Length:

.157 in, 4 mm
PCB Contact Termination Area Plating Material Thickness:

100 – 200 µin, 3 – 5 µm
PCB Thickness (Recommended):

.063 in, 1.6 mm
Sealable:

No
Header Type:

Partially Shrouded
Connector Length:

.472 in, 12 mm
Contact Base Material:

Phosphor Bronze
Termination Method to Printed Circuit Board:

Through Hole - Solder
Termination Post & Tail Length:

.11 in, 2.8 mm
Mating Square Post Dimension:

.02 in, .5 mm
Operating Temperature Range:

-40 – 105 °C, -40 – 221 °F
PCB Contact Termination Area Plating Material Finish:

Matte
Number of Positions:

5
Centerline (Pitch):

.079 in, 2 mm
Insulation Resistance:

1000 MΩ
Connector Profile:

Standard
Connector & Contact Terminates To:

Printed Circuit Board
Contact Mating Area Plating Material:

Tin
Contact Shape & Form:

Square
Square Termination Post & Tail Dimension:

.02 in, .5 mm
Primary Product Color:

Black
Dielectric Withstanding Voltage (Max):

650 V
Contact Type:

Pin
Housing Temperature Rating:

High
Operating Voltage:

250 VAC
Mating Retention:

With
Packaging Type:

Tube
Contact Mating Area Plating Material Finish:

Matte
PCB Connector Assembly Type:

PCB Mount Header
PCB Mount Retention:

Without
Contact Layout:

Inline
UL Flammability Rating:

UL 94V-0
Mating Retention Type:

Center Latch
Contact Underplating Material:

Nickel
Connector Mounting Type:

Board Mount
Number of Rows:

1
Contact Current Rating (Max):

2 A
Solder Process Feature:

Board Standoff
Connector System:

Board-to-Board , Wire-to-Board
Contact Mating Area Plating Material Thickness:

100 – 200 µin, 3 – 5 µm
PCB Contact Termination Area Plating Material:

Tin
Contact Underplating Material Thickness:

1.27 µm
PCB Mount Alignment:

Without
Housing Material:

Liquid Crystal Polymer (LCP)
Circuit Application:

Signal
PCB Mount Orientation:

Right Angle