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23 MODII HDR SRST UNSHRD STKG

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Description +
23 MODII HDR SRST UNSHRD STKG
Search Keywords: 21464603
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    2-146460-3
  • Unit of Measure:
    Per Each
  • RoHS:
    No
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    75
  • PCB Mount Orientation:
    Vertical
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Number of Positions:
    23
  • Contact Type:
    Pin
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • Insulation Resistance:
    5000 MΩ
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Stack Height:
    .45 in, 11.43 mm
  • Contact Mating Area Plating Material:
    Tin-Lead
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • Contact Current Rating (Max):
    3 A
  • UL Flammability Rating:
    UL 94V-0
  • Contact Base Material:
    Copper Alloy
  • Number of Rows:
    1
  • Approved Standards:
    CSA LR7189 , UL E28476
  • Stackable:
    Yes
  • Housing Material:
    Thermoplastic
  • PCB Mount Retention:
    Without
  • Contact Layout:
    Inline
  • Packaging Quantity:
    75
  • PCB Thickness (Recommended):
    .062 in, 1.57 mm
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Primary Product Color:
    Black
  • Connector Mounting Type:
    Board Mount
  • Contact Mating Area Length:
    .109 in, 2.79 mm
  • Contact Shape & Form:
    Square
  • PCB Contact Termination Area Plating Material Finish:
    Matte
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Agency/Standard:
    CSA , UL
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Contact Underplating Material Thickness:
    50 µin, 1.27 µm
  • Connector System:
    Board-to-Board
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
  • Contact Mating Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Circuit Application:
    Signal
  • Mating Alignment:
    Without
  • PCB Mount Alignment:
    Without
  • Header Type:
    Breakaway
  • Contact Underplating Material:
    Nickel
  • Termination Post & Tail Length:
    .057 in, 1.45 mm
  • Packaging Type:
    Carton
  • Board-to-Board Configuration:
    Parallel
  • Sealable:
    No
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
19
9 Weeks can ship 8/10/26
Backorder
Price (USD)
Qty
Unit Price
19
$16.72
38
$12.54
57
$11.70
75 +
$11.47
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