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5-2007615-5
5-2007615-5

TE Connectivity / AMP Brand

In Stock: 0

Minimum Order: 224

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STEP-Z, RECEPTACLE ASSEMBLY, 200 SIGNAL POSITION

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Datasheet Accessories

RoHS Compliant
Discontinued & Replaced
Packaging
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Description +
STEP-Z, RECEPTACLE ASSEMBLY, 200 SIGNAL POSITION
Search Keywords: 20076155
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    2007615-5
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • UL Flammability Rating:
    UL 94V-0
  • Assembly Process Feature:
    None
  • Connector Mounting Type:
    Board Mount
  • Contact Mating Area Plating Material:
    Gold
  • Stack Height:
    1.181 in, 15 mm, 17 mm, 18 mm, 20 mm, 25 mm, 30 mm
  • Stackable:
    Yes
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • Mating Tab Width:
    .039 in, 1 mm
  • Dielectric Withstanding Voltage (Max):
    500 VDC
  • Packaging Method:
    Tray
  • Contact Base Material:
    Copper Alloy
  • Operating Temperature Range:
    0 – 100 °C, 32 – 212 °F
  • Operating Voltage:
    48 VAC
  • Housing Material:
    Thermoplastic
  • PCB Connector Assembly Type:
    PCB Mount Receptacle
  • Circuit Application:
    Power & Signal
  • Number of Positions:
    200
  • Sealable:
    No
  • Housing Color:
    Natural
  • Number of Rows:
    18
  • PCB Mount Alignment:
    Without
  • Centerline (Pitch):
    .051 in, 1.3 mm
  • Contact Shape & Form:
    Dual Beam , Single Beam
  • Contact Type:
    Socket
  • Row-to-Row Spacing:
    .0786 in, 2 mm
  • Mating Retention:
    With
  • Mating Tab Thickness:
    .008 in, .2 mm
  • PCB Thickness (Recommended):
    .8 in, 1.57 mm
  • Insulation Resistance:
    18 MΩ
  • Mating Alignment:
    Without
  • PCB Mount Orientation:
    Vertical
  • Board-to-Board Configuration:
    Parallel
  • PCB Mount Retention:
    Without
  • Contact Mating Area Plating Material Thickness:
    29.9212 µin, .76 µm
  • Contact Current Rating (Max):
    1 A
  • Termination Method to Printed Circuit Board:
    Surface Mount - Solder Ball
  • Contact Layout:
    Matrix
  • Connector Height:
    .418545 in, 10.65 mm
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Connector System:
    Board-to-Board
  • Packaging Quantity:
    28
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  • Item discontinued
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