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02 MODII HDR DRST UNSHRD STKG

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Description +
02 MODII HDR DRST UNSHRD STKG
Search Keywords: 1464861
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    146486-1
  • Unit of Measure:
    Per Each
  • RoHS:
    No
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    432
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • PCB Mount Orientation:
    Vertical
  • Contact Type:
    Pin
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Contact Mating Area Length:
    .109 in, 2.79 mm
  • Contact Mating Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Connector Mounting Type:
    Board Mount
  • Mating Alignment:
    Without
  • Contact Current Rating (Max):
    3 A
  • Header Type:
    Unshrouded
  • Housing Material:
    Thermoplastic
  • Number of Positions:
    2
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Stack Height:
    .3 in, 7.62 mm
  • PCB Mount Alignment:
    Without
  • Sealable:
    No
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • Circuit Application:
    Signal
  • Approved Standards:
    CSA LR7189 , UL E28476
  • Stackable:
    Yes
  • Contact Shape & Form:
    Square
  • Number of Rows:
    2
  • Contact Mating Area Plating Material:
    Tin-Lead
  • UL Flammability Rating:
    UL 94V-0
  • Contact Base Material:
    Copper Alloy
  • Termination Post & Tail Length:
    .123 in, 3.12 mm
  • Connector System:
    Board-to-Board
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Board-to-Board Configuration:
    Parallel
  • PCB Mount Retention:
    Without
  • Insulation Resistance:
    5000 MΩ
  • Assembly Process Feature:
    None
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin
  • Row-to-Row Spacing:
    .1 in, 2.54 mm
  • PCB Thickness (Recommended):
    .055 in, 1.4 mm
  • Primary Product Color:
    Black
  • Packaging Type:
    Package
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In Stock: 0
MOQ for out of Stock Qty:
1080
9 Weeks can ship 7/14/26
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Price (USD)
Qty
Unit Price
1,080
$0.8293
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$0.5104
3,240
$0.4040
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$0.3959
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