Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Heat Sink Passive TO-220 Aluminum 10.83°C/W Black Anodized
Extruded Heat Sinks For Power Semiconductors
Heat Sink Passive Straight Adhesive 0.56°C/W
Heat Sink Passive
Exposed Tube 2- Pass Coldplate
12 Inch High Aspect Ratio Thermal Extrusions
OEMs, CMs ONLY (NO BROKERS)
Heat Sink Passive 0.045°C/W
Heat Sink; Body Material: Aluminum; Sink Material: Aluminum; Size: 0.850 Sq x 0.400 H"