Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Jmk063B7103Kp-F |Taiyo Yuden JMK063B7103KP-F
Ind Chip Wirewound 10uH 10% 2.52MHz Ferrite 340mA 1207 Embossed T/R
Ind High Frequency Chip Multi-Layer 4.7nH 0.3nH 100MHz 12Q-Factor Ceramic 220mA 0805 Embossed T/R
Ind Chip Wirewound 2.2uH 20% 7.96MHz Ferrite 480mA 1007 Embossed T/R
Ind High Frequency Chip Multi-Layer 1.5nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0603 Paper T/R
Ind Chip Wirewound 4.7uH 20% 7.96MHz Ferrite 190mA 0805 Embossed T/R
Ind High Frequency Chip Multi-Layer 1.5nH 0.3nH 100MHz 10Q-Factor Ceramic 300mA 0805 Embossed T/R
Ind Chip Wirewound 47uH 10% 2.52MHz Ferrite 70mA 0806 Embossed T/R
Ind Chip Wirewound 2.2uH 20% 7.96MHz Ferrite 775mA 1207 Embossed T/R
Ind Chip Wirewound 22uH 10% 2.52MHz Ferrite 115mA 1007 Embossed T/R