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827261-8
TE Connectivity / AMP Brand
8P AMPMODU II STIFT LEI
Datasheet Accessories Notify Me
RoHS Compliant
Box Packaging
Certificate of Compliance Guarantee
Description
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8P AMPMODU II STIFT LEI
Search Keywords: 8272618
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:TE Connectivity / AMP Brand
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Part No:827261-8
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8538906000
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COO:US
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ECCN:EAR99
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Supplier Standard Pack:
500 -
Termination Method to Printed Circuit Board:Through Hole - Solder
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Contact Mating Area Plating Material:Gold Flash over Palladium Nickel
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Centerline (Pitch):.1 in, 2.54 mm
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Housing Material:PBT GV
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Connector & Contact Terminates To:Printed Circuit Board
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Mating Alignment:Without
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Contact Mating Area Plating Material Thickness:31.49 µin, .8 µm
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PCB Thickness (Recommended):.055 in, 1.4 mm
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Contact Current Rating (Max):5 A
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Operating Temperature Range:-65 – 105 °C, -85 – 221 °F
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PCB Mount Alignment:Without
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UL Flammability Rating:UL 94V-0
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Circuit Application:Signal
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Connector System:Board-to-Board
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Board-to-Board Configuration:Parallel
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Header Type:Breakaway
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Number of Rows:1
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Number of Positions:8
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Primary Product Color:Green
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PCB Mount Retention:Without
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Contact Type:Pin
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PCB Connector Assembly Type:PCB Mount Header
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Packaging Type:Box , Carton
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PCB Mount Orientation:Vertical
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Connector Mounting Type:Board Mount
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Sealable:No
Tools/3D Models
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
1500
9 Weeks
can ship
7/6/26
Price (USD)
Qty
Unit Price
1,500
$6.61
3,000
$3.38
4,500
$2.30
6,000 +
$2.25
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