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TE Connectivity / AMP Brand
5646376-1
2MM HM,ASY,T-E,HDR,10R,250,AP
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| Product Attribute | Attribute Value Select Attribute |
|---|---|
| Supplier: | TE Connectivity / AMP Brand |
| Part No: | 5646376-1 |
| Unit of Measure: | Per Each |
| RoHS: | Yes |
| HTS: | 8536694040 |
| COO: | US |
| ECCN: | EAR99 |
Supplier's Standard Package:
|
10 |
| Connector System: | Board-to-Board |
| Connector Mounting Type: | Board Mount |
| Data Rate: | ≤1 Gb/s |
| Mating Alignment Type: | Multi-Purpose Center |
| PCB Contact Termination Area Plating Material: | Tin |
| Number of Rows: | 10 |
| CompactPCI Designation: | None |
| Sealable: | No |
| Contact Base Material: | Phosphor Bronze |
| Contact Type: | Pin |
| Shielded: | No |
| Number of Signal Positions: | 200 |
| Contact Underplating Material: | Nickel |
| Connector & Contact Terminates To: | Printed Circuit Board |
| Packaging Quantity: | 10 |
| Housing Material: | Polyester - GF |
| Contact Current Rating (Max): | 1.5 A |
| UL Flammability Rating: | UL 94V-0 |
| Crosstalk Version: | Standard |
| Backplane Interface Type: | 2mm HM |
| Number of Positions: | 250 |
| Front Mating Level: | Level 1 |
| Termination Method to Printed Circuit Board: | Through Hole - Press-Fit |
| Circuit Application: | Signal |
| PCB Mount Orientation: | Vertical |
| Backplane Architecture: | Mezzanine |
| Packaging Method: | Tube |
| PCB Connector Assembly Type: | PCB Mount Header |
| Backplane Module Length: | 50 mm |
| Number of Columns: | 25 |
| Contact Mating Area Plating Material Thickness: | 30 µin, .76 µm |
| Centerline (Pitch): | .078 in, 2 mm |
| Operating Temperature Range: | -55 – 125 °C, -67 – 257 °F |
| Rows Loaded: | A , B , C , D , E , F , G , H , I , Z |
| Contact Mating Area Length: | 5.25 mm, 6.75 mm, 8.25 mm |
| Primary Product Color: | Gray |
| Contact Mating Area Plating Material: | Gold , Gold Flash over Palladium Nickel |