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536272-9
TE Connectivity / AMP Brand
PLUG ASSEMBLY, 10.92[.430] STACK, 3.18[.125] TAIL, BOARD TO BOARD, MICRO-STRIP
Datasheet Accessories
RoHS Non-Compliant
Discontinued
Tube Packaging
Certificate of Compliance Guarantee
Description
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PLUG ASSEMBLY, 10.92[.430] STACK, 3.18[.125] TAIL, BOARD TO BOARD, MICRO-STRIP
Product Highlights:
- Connector
- Housing Gender = Plug
- 200 Positions
- Vertical Mount Angle
- PCB Termination Type = Soldertail
Search Keywords: 5362729
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:TE Connectivity / AMP Brand
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Part No:536272-9
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Unit of Measure:Per Each
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RoHS:No
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HTS:8536694040
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COO:US
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ECCN:EAR99
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Supplier Standard Pack:
4 -
Number of Rows:2
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Insulation Resistance:2 MΩ, 200 VAC
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Number of Positions:200
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Connector Type:Connector Assembly
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Connector System:Board-to-Board
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Height:.34 in, 8.64 mm
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Boss:No
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Tail Length:.125 in
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Busbar Mating Area Plating Thickness:30
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Housing Material:High Temperature Thermoplastic
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PCB Mount Orientation:Vertical
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Mating Alignment Type:Polarization
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PCB Mount Retention:Without
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Packaging Method:Tube
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Flame Retardant:Yes
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Row-to-Row Spacing:.1 in, 2.54 mm
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Packaging Quantity:4
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Contact Type:Pin
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Voltage:30 VAC
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PCB Thickness (Recommended):.76 in
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Solder Process Feature:Board Standoff
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Busbar Mating Area Plating Material:Gold
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Stackable:Yes
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Connector Assembly Type:PCB Mount Header
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Termination Method to Printed Circuit Board:Through Hole - Solder
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Connector & Contact Terminates To:Printed Circuit Board
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PCB Mount Alignment Type:Locating Posts
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Contact Base Material:Phosphor Bronze
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For Use With:Receptacle Assembly
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Contact Current Rating (Max):10.5 A
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Operating Temperature Range:-65 – 125 °C, -85 – 257 °F
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Stack Height:.43 in, 10.92 mm
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Busbar Material:Phosphor Bronze
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Cover Material:Phosphor Bronze
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PCB Contact Termination Area Plating Thickness:100 – 300 µin
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Circuit Application:Signal
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Mating Alignment:With
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PCB Mount Alignment:With
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Sealable:No
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Product Type:Connector
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PCB Contact Termination Area Plating Material:Tin-Lead
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Pick and Place Cover:Without
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Centerline (Pitch):.05 in, 1.27 mm
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Contact Mating Area Plating Thickness:30 µin, .76 µm
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Contact Mating Area Plating Material:Gold
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Busbar Termination Area Plating Material:Tin-Lead with Nickel underplated
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Connector Mounting Type:Board Mount
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Board-to-Board Configuration:Vertical
Product Guides
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- Item discontinued
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