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08 MODII HDR SRST UNSHRD STKG

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Description +
08 MODII HDR SRST UNSHRD STKG
Search Keywords: 51464658
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    5-146465-8
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    MX
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    200
  • Stack Height:
    .7 in, 17.78 mm
  • Insulation Resistance:
    5000 MΩ
  • Contact Mating Area Plating Material:
    Tin
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Contact Layout:
    Inline
  • PCB Contact Termination Area Plating Material:
    Tin
  • Contact Type:
    Pin
  • Number of Rows:
    1
  • Contact Base Material:
    Copper Alloy
  • Housing Material:
    Thermoplastic
  • PCB Mount Orientation:
    Vertical
  • Contact Current Rating (Max):
    3 A
  • PCB Mount Retention:
    Without
  • UL Flammability Rating:
    UL 94V-0
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Stackable:
    Yes
  • Number of Positions:
    8
  • Agency/Standard:
    CSA , UL
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Circuit Application:
    Signal
  • Contact Shape & Form:
    Square
  • PCB Thickness (Recommended):
    .062 in, 1.57 mm
  • Board-to-Board Configuration:
    Parallel
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Contact Underplating Material:
    Nickel
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Contact Mating Area Length:
    .109 in, 2.79 mm
  • PCB Contact Termination Area Plating Material Finish:
    Matte
  • Sealable:
    No
  • Connector Mounting Type:
    Board Mount
  • Approved Standards:
    CSA LR7189 , UL E28476
  • Contact Underplating Material Thickness:
    50 µin, 1.27 µm
  • Mating Alignment:
    Without
  • Packaging Type:
    Package
  • Connector System:
    Board-to-Board
  • Contact Mating Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Primary Product Color:
    Black
  • Header Type:
    Breakaway
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
  • Termination Post & Tail Length:
    .12 in, 3.05 mm
  • PCB Mount Alignment:
    Without
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In Stock: 0
MOQ for out of Stock Qty:
500
9 Weeks can ship 7/2/26
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Price (USD)
Qty
Unit Price
500
$4.38
1,000
$2.32
1,500
$1.63
2,000 +
$1.60
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