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5-146461-3 by te connectivity / amp brand
Image is representational - see mfr. specs

5-146461-3

TE Connectivity / AMP Brand

03 MODII HDR SRST UNSHRD STKG

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RoHS Compliant
Packaging
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Description +
03 MODII HDR SRST UNSHRD STKG
Search Keywords: 51464613
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    5-146461-3
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Contact Type:
    Pin
  • Contact Mating Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Contact Mating Area Length:
    .109 in, 2.79 mm
  • Contact Shape & Form:
    Square
  • PCB Mount Orientation:
    Vertical
  • Sealable:
    No
  • Contact Current Rating (Max):
    3 A
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Number of Positions:
    3
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Contact Mating Area Plating Material:
    Tin
  • Circuit Application:
    Signal
  • PCB Contact Termination Area Plating Material:
    Tin
  • Termination Post & Tail Length:
    .129 in, 3.27 mm
  • Contact Layout:
    Inline
  • Connector Mounting Type:
    Board Mount
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • UL Flammability Rating:
    UL 94V-0
  • Connector System:
    Board-to-Board
  • Header Type:
    Unshrouded
  • Number of Rows:
    1
  • Approved Standards:
    CSA LE7189 , UL E28476
  • Housing Material:
    Thermoplastic
  • Contact Base Material:
    Copper Alloy
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
  • Stackable:
    Yes
  • Board-to-Board Configuration:
    Parallel
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • Mating Alignment:
    Without
  • Stack Height:
    .5 in, 12.7 mm
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin
  • Insulation Resistance:
    5000 MΩ
  • PCB Mount Retention:
    Without
  • PCB Mount Alignment:
    Without
  • PCB Thickness (Recommended):
    .055 in, 1.4 mm
  • Packaging Type:
    Bag
  • Primary Product Color:
    Black
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
250
9 Weeks can ship 7/2/26
Backorder
Price (USD)
Qty
Unit Price
250
$1.093
500
$0.820
750
$0.765
1,000 +
$0.750
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