4-2331929-7

TE Connectivity / AMP Brand

SCL 1.0 HDR DRVT USP 094 SMT G3 TBK

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RoHS Compliant

Tube Packaging

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SCL 1.0 HDR DRVT USP 094 SMT G3 TBK

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Supplier:

TE Connectivity / AMP Brand
Part No:

4-2331929-7
Alias/AKA:

1MM-HU-D47-VS-00-H-TBP
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8536694040
COO:

US
ECCN:

EAR99
Supplier Standard Pack:

11
Operating Temperature Range:

-55 – 125 °C, -67 – 257 °F
Housing Temperature Rating:

High
Contact Type:

Pin
Contact Mating Area Length:

.082 in, 2.1 mm
Primary Product Color:

Black
Number of Signal Positions:

94
Mating Entry Location:

Top
Pairs per Column:

1
PCB Mount Orientation:

Vertical
Contact Shape & Form:

Square
Housing Material:

LCP
Number of Rows:

2
Connector Profile:

Standard
Centerline (Pitch):

.04 in, 1 mm
Assembly Process Feature Material:

Thermoplastic
Number of Columns:

47
Termination Method to Printed Circuit Board:

Surface Mount
Contact Underplating Material:

Nickel
Stackable:

No
Contact Current Rating (Max):

1 A
Connector System:

Board-to-Board
Packaging Type:

Tube
Row-to-Row Spacing:

.04 in, 1 mm
PCB Contact Termination Area Plating Material Thickness:

100 – 200 µin, 3 – 5 µm
Connector Mounting Type:

Board Mount
Mating Square Post Dimension:

.012 in, .3 mm
PCB Contact Termination Area Plating Material:

Tin
Number of Loaded Positions:

94
Number of Positions:

94
Contact Underplating Material Thickness:

50 µin, 1.27 µm
Contact Mating Area Plating Material Thickness:

30 µin, .76 µm
PCB Contact Termination Area Plating Material Finish:

Matte
Contact Base Material:

Phosphor Bronze
PCB Connector Assembly Type:

PCB Mount Header
PCB Mount Retention:

Without
Mating Alignment:

Without
UL Flammability Rating:

UL 94V-0
Contact Mating Area Plating Material:

Gold
Contact Layout:

Inline
Header Type:

Unshrouded
Circuit Application:

Signal
Connector Height:

.06 in, 1.5 mm
Connector & Contact Terminates To:

Printed Circuit Board
Assembly Process Feature:

Pick and Place Cover
Square Termination Post & Tail Dimension:

.012 in, .3 mm
Solder Process Feature:

Board Standoff