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38 MODII HDR SRST UNSHRD STKG

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Description +
38 MODII HDR SRST UNSHRD STKG
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SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    3-146472-8
  • Unit of Measure:
    Per Each
  • RoHS:
    No
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    125
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Centerline (Pitch):
    .1 in, 2.54 mm
  • Stackable:
    Yes
  • UL Flammability Rating:
    UL 94V-0
  • Contact Current Rating (Max):
    3 A
  • PCB Mount Orientation:
    Vertical
  • PCB Mount Retention:
    Without
  • Contact Type:
    Pin
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • Stack Height:
    .7 in, 17.78 mm
  • Contact Mating Area Plating Material:
    Gold
  • Number of Rows:
    1
  • Housing Material:
    Thermoplastic
  • Approved Standards:
    CSA LR7189 , UL E28476
  • Insulation Resistance:
    5000 MΩ
  • Contact Layout:
    Inline
  • PCB Connector Assembly Type:
    PCB Mount Header
  • Number of Positions:
    38
  • Termination Method to Printed Circuit Board:
    Through Hole - Solder
  • Contact Mating Area Plating Material Thickness:
    15 µin, .38 µm
  • PCB Mount Alignment:
    Without
  • Contact Mating Area Length:
    .33 in, 8.38 mm
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Termination Post & Tail Length:
    .1 in, 2.54 mm
  • PCB Contact Termination Area Plating Material Finish:
    Matte
  • PCB Thickness (Recommended):
    .062 in, 1.57 mm
  • Mating Square Post Dimension:
    .025 in, .64 mm
  • Contact Shape & Form:
    Square
  • Header Type:
    Breakaway
  • Primary Product Color:
    Black
  • PCB Contact Termination Area Plating Material Thickness:
    100 – 200 µin, 2.54 – 5.08 µm
  • Board-to-Board Configuration:
    Parallel
  • Square Termination Post & Tail Dimension:
    .025 in, .64 mm
  • Contact Underplating Material:
    Nickel
  • Contact Base Material:
    Copper Alloy
  • Mating Alignment:
    Without
  • Circuit Application:
    Signal
  • Connector System:
    Board-to-Board
  • Agency/Standard:
    CSA , UL
  • Contact Underplating Material Thickness:
    50 µin, 1.27 µm
  • Sealable:
    No
  • Packaging Type:
    Package
  • Connector Mounting Type:
    Board Mount
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In Stock: 0
MOQ for out of Stock Qty:
313
9 Weeks can ship 7/3/26
Backorder
Price (USD)
Qty
Unit Price
313
$28.56
625
$15.10
938
$10.38
1,250 +
$10.17
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