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2227838-7
TE Connectivity / AMP Brand
The 2227838-7 is a thermally enhanced, 2x8 stacked zSFP+ pluggable I/O interconnect assembly.
Datasheet Accessories Notify Me
RoHS Compliant
Tray Packaging
Certificate of Compliance Guarantee
Description
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The 2227838-7 is a thermally enhanced, 2x8 stacked zSFP+ pluggable I/O interconnect assembly.
Search Keywords: 22278387
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:TE Connectivity / AMP Brand
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Part No:2227838-7
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8536694040
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
3 -
Connector System:Cable-to-Board
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Termination Method to Printed Circuit Board:Through Hole - Press-Fit
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Pluggable I/O Product Type:Cage Assembly with Integrated Connector
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Heat Sink Compatible:No
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Number of Positions:480
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Lightpipe Style:Standard
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Data Rate (Max):32 Gb/s
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Pluggable I/O Applications:zSFP+ Thermally Enhanced
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Packaging Method:Tray
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Sealable:No
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Connector & Contact Terminates To:Printed Circuit Board
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Tail Plating Material:Tin
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Circuit Application:Signal
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For Use With Pluggable I/O Products:zSFP+ SMT Connector
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Cage Type:Stacked
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Connector Mounting Type:Board Mount
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Form Factor:zSFP+ Stacked (SFP28)
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Number of Ports:24
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UL Flammability Rating:UL 94V-0
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Port Matrix Configuration:2 x 12
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Cage Material:Nickel Silver Alloy
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Lightpipe Configuration:Dual Triangular (Inner)
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Centerline (Pitch):.032 in, .8 mm
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PCB Thickness (Recommended):.059 in, 1.5 mm
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Operating Temperature Range:0 – 70 °C, 32 – 158 °F
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Contact Mating Area Plating Material Thickness:29.92 µin, .76 µm
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Termination Post & Tail Length:.07 in, 1.8 mm
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EMI Containment Feature Type:Internal/External EMI Springs
Tools/3D Models
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We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
3
10 Weeks
can ship
7/13/26
Price (USD)
Qty
Unit Price
3
$240.85
5
$177.86
7
$150.86
9 +
$147.84
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