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2198226-1
TE Connectivity / AMP Brand
SFP+ Enhanced 1x2, PCI Heatsink, LP
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RoHS Compliant
Certificate of Compliance Guarantee
Description
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SFP+ Enhanced 1x2, PCI Heatsink, LP
Search Keywords: 21982261
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:TE Connectivity / AMP Brand
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Part No:2198226-1
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Unit of Measure:Per Each
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RoHS:Yes
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ECCN:EAR99
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Supplier Standard Pack:
1 -
Number of Ports:2
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Thermal Accessory Type Included:Heat Sink
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Heat Sink Style:Pin
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Sealable:Yes
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Connector Mounting Type:Board Mount
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Form Factor:SFP+
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Data Rate (Max):16 Gb/s
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Port Matrix Configuration:1 x 2
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For Use With Pluggable I/O Products:SFP+ SMT Connector
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Connector & Contact Terminates To:Printed Circuit Board
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Circuit Application:Signal
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Lightpipe Configuration:Dual Round
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Pluggable I/O Product Type:Cage Assembly
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Lightpipe Profile:Standard
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Lightpipe Style:Reduced Length
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EMI Containment Feature Type:Elastomeric Gasket
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Heat Sink Height Class:PCI
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Termination Method to Printed Circuit Board:Through Hole - Press-Fit
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Cage Type:Ganged
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Cage Material:Nickel Silver
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Connector System:Cable-to-Board
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Heat Sink Compatible:Yes
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Pluggable I/O Applications:SFP+ Enhanced
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Operating Temperature Range:-55 – 105 °C, -67 – 221 °F
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PCB Thickness (Recommended):.059 in, 1.5 mm
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Heat Sink Height:.165 in, 4.2 mm
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Packaging Method:Box & Tray , Tray
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Termination Post & Tail Length:.081 in, 2.05 mm
Tools/3D Models
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Product Guides
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
27
9 Weeks
can ship
7/1/26
Price (USD)
Qty
Unit Price
27
$49.93
54
$30.73
81
$24.32
108 +
$23.84
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