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2170190-2
TE Connectivity / AMP Brand
SFP+ Enhanced 1x2, W/ High Heatsink
Datasheet Accessories Notify Me
RoHS Compliant
Certificate of Compliance Guarantee
Description
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SFP+ Enhanced 1x2, W/ High Heatsink
Search Keywords: 21701902
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:TE Connectivity / AMP Brand
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Part No:2170190-2
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Unit of Measure:Per Each
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RoHS:Yes
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Supplier Standard Pack:
1 -
Pluggable I/O Applications:SFP+ Enhanced
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For Use With Pluggable I/O Products:SFP+ SMT Connector
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Connector Mounting Type:Board Mount
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Heat Sink Style:Pin
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Pluggable I/O Product Type:Cage Assembly
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Termination Method to Printed Circuit Board:Through Hole - Press-Fit
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Form Factor:SFP+
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Port Matrix Configuration:1 x 2
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Number of Ports:2
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Connector System:Cable-to-Board
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Thermal Accessory Type Included:Heat Sink
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Cage Type:Ganged
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Circuit Application:Signal
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Connector & Contact Terminates To:Printed Circuit Board
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Heat Sink Compatible:Yes
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Data Rate (Max):16 Gb/s
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Sealable:No
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Cage Material:Nickel Silver
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Heat Sink Height:.413 in, 10.5 mm
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PCB Thickness (Recommended):.089 in, 2.25 mm
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Operating Temperature Range:-55 – 105 °C, -67 – 221 °F
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Packaging Method:Box & Tray , Tray
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Termination Post & Tail Length:.081 in, 2.05 mm
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EMI Containment Feature Type:Internal/External EMI Springs
Tools/3D Models
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Product Guides
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
20
9 Weeks
can ship
6/30/26
Price (USD)
Qty
Unit Price
20
$33.12
40
$20.38
60
$16.14
80 +
$15.81
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