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SOCKET ASSEMBLY VLP DDR-III, T/H, 240P

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RoHS Compliant
Tray Packaging
Certificate of Compliance Guarantee
Description +
SOCKET ASSEMBLY VLP DDR-III, T/H, 240P
Search Keywords: 119326807
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    1-1932680-7
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    54
  • Ejector Material Color:
    Natural
  • Module Key Type:
    Offset Left
  • Centerline (Pitch):
    .07 in, 2 mm
  • DRAM Type:
    Double Data Rate (DDR) 3
  • Housing Material:
    High Temperature Nylon
  • Contact Mating Area Plating Material:
    Gold
  • Center Key:
    Offset Left
  • Circuit Application:
    Signal
  • Retention Post Material:
    Copper Alloy
  • Operating Temperature Range:
    -40 – 85 °C, -40 – 185 °F
  • Contact Base Material:
    Copper Alloy
  • PCB Contact Termination Area Plating Material:
    Tin
  • Housing Color:
    Black
  • Connector Mounting Type:
    Board Mount
  • UL Flammability Rating:
    UL 94V-0
  • PCB Mounting Style:
    Through Hole - Solder
  • Module Orientation:
    Vertical
  • Solder Tail Contact Plating Thickness:
    100 µin, 2.54 µm
  • Locating Posts:
    Without
  • Number of Keys:
    1
  • Mounting Angle:
    Vertical
  • PCB Mount Retention Type:
    Boardlock
  • Boardlock Material:
    Copper Alloy
  • Contact Current Rating (Max):
    .5 A
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Latch Material:
    Thermoplastic
  • Ejector Type:
    Rotary
  • Insertion Style:
    Direct Insert
  • Number of Bays:
    2
  • Packaging Method:
    Soft Tray
  • Latch Color:
    Natural
  • Product Type:
    Socket
  • Number of Positions:
    240
  • Center Post:
    Without
  • Row-to-Row Spacing:
    .037 in, .95 mm
  • Socket Type:
    Memory Card
  • Sealable:
    No
  • Ejector Material:
    Thermoplastic
  • DRAM Voltage:
    1.5 V
  • Center Retention Hole Diameter:
    .096 in, 2.45 mm
  • Contact Mating Area Plating Thickness:
    15 µin, .38 µm
  • Ejector Location:
    Both Ends
  • Packaging Quantity:
    54
  • Keying:
    Standard
  • Socket Style:
    DIMM
  • Height above PC Board:
    .82 in, 21 mm
  • Connector System:
    Board-to-Board
  • Retention Post Location:
    Both Ends
  • Termination Post Length:
    .125 in, 3.18 mm
  • Number of Rows:
    2
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
1350
Order Increment:
54
6 Weeks can ship 6/11/26
Backorder
Price (USD)
Qty
Unit Price
1,350
$5.30
2,700
$2.80
4,050
$1.92
5,400 +
$1.88
Click for Quote
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