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SOCKET ASSEMBLY VLP DDR-III, T/H, 240P

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RoHS Compliant
Tray Packaging
Certificate of Compliance Guarantee
Description +
SOCKET ASSEMBLY VLP DDR-III, T/H, 240P
Search Keywords: 119326802
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    TE Connectivity / AMP Brand
  • Part No:
    1-1932680-2
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    54
  • Row-to-Row Spacing:
    .075 in, 1.9 mm
  • Solder Tail Contact Plating Thickness:
    100 µin, 2.54 µm
  • Centerline (Pitch):
    .07 in, 2 mm
  • Module Key Type:
    Offset Left
  • Termination Post Length:
    .1 in, 2.54 mm
  • Packaging Method:
    Soft Tray
  • DRAM Type:
    Double Data Rate (DDR) 3
  • Latch Color:
    Black
  • Center Key:
    Offset Left
  • Ejector Material:
    Thermoplastic
  • Insertion Style:
    Direct Insert
  • PCB Contact Termination Area Plating Material:
    Tin
  • Number of Bays:
    2
  • PCB Mounting Style:
    Through Hole - Solder
  • Locating Posts:
    Without
  • Sealable:
    No
  • Mounting Angle:
    Vertical
  • Operating Temperature Range:
    -40 – 85 °C, -40 – 185 °F
  • Housing Color:
    Black
  • Contact Mating Area Plating Material:
    Gold
  • Contact Base Material:
    Copper Alloy
  • Number of Keys:
    1
  • Connector System:
    Board-to-Board
  • Connector Mounting Type:
    Board Mount
  • UL Flammability Rating:
    UL 94V-0
  • Circuit Application:
    Signal
  • Retention Post Material:
    Copper Alloy
  • Center Post:
    Without
  • Ejector Type:
    Rotary
  • Module Orientation:
    Vertical
  • Socket Style:
    DIMM
  • Contact Current Rating (Max):
    .5 A
  • Number of Positions:
    240
  • Product Type:
    Socket
  • Retention Post Location:
    Both Ends
  • Height above PC Board:
    .82 in, 21 mm
  • Contact Mating Area Plating Thickness:
    20 µin, .51 µm
  • Ejector Location:
    Both Ends
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • PCB Mount Retention Type:
    Boardlock
  • Keying:
    Standard
  • Housing Material:
    High Temperature Nylon
  • Boardlock Material:
    Copper Alloy
  • Socket Type:
    Memory Card
  • Center Retention Hole Diameter:
    .096 in, 2.45 mm
  • Latch Material:
    Thermoplastic
  • DRAM Voltage:
    1.5 V
  • Packaging Quantity:
    54
  • Number of Rows:
    2
  • Ejector Material Color:
    Black
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
1350
Order Increment:
54
9 Weeks can ship 7/2/26
Backorder
Price (USD)
Qty
Unit Price
1,350
$5.53
2,700
$2.92
4,050
$2.01
5,400 +
$1.97
Click for Quote
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