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44764-0401 by molex / waldom
Image is representational - see mfr. specs

44764-0401

Molex / Waldom

Conn Wire to Board RCP 4 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

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Datasheet Accessories Notify Me

RoHS Compliant
Tray Packaging
Certificate of Compliance Guarantee
Description +
Conn Wire to Board RCP 4 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Search Keywords: 447640401
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Molex / Waldom
  • Part No:
    44764-0401
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Type:
    Wire to Board
  • Body Orientation:
    Right Angle
  • Gender:
    RCP
  • Mounting:
    Through Hole
  • Pitch:
    3 mm
  • Number of Contacts:
    4
  • Maximum Voltage Rating:
    600 V
  • Maximum Current Rating:
    5/Contact A
  • Termination Method:
    Solder
  • Operating Temperature:
    -40 to 105 °C
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 970
Can Ship immediately
Minimum Order Quantity:
40
14 Weeks can ship 8/3/26
ADD TO CART
Price (USD)
Qty
Unit Price
45
$1.65
250
$1.62
450
$1.60
900
$1.56
1,960
$1.54
4,000
$1.35
10,000 +
$1.31
Click for Quote
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