PIC16LF877-04I/PT by microchip technology

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PIC16LF877-04I/PT

Microchip Technology

MCU 8-bit PIC16 PIC RISC 14.3KB Flash 5V 44-Pin TQFP

Datasheet Accessories Notify Me

RoHS Compliant

TRAY Packaging

Certificate of Compliance Guarantee

Description +

MCU 8-bit PIC16 PIC RISC 14.3KB Flash 5V 44-Pin TQFP

Search Keywords: PIC16LF87704IPT

SPECS +

Product Attribute

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Supplier:

Microchip Technology
Part No:

PIC16LF877-04I/PT
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8542310015
COO:

TH
ECCN:

EAR99
Supplier Standard Pack:

160
Number of Programmable I/Os:

33
Program Memory Type:

Flash
Program Memory Size:

14.3 KB
Operating Temperature:

-40 to 85 °C

Tools/3D Models +

EE ToolBox

Product Guides +

Datasheet

Product Changes +

PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 01-Apr-2006 - QUALIFICATON OF 44L PLCC AT NEW ASSEMBLY SITE: AIC

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 11-Nov-2004 - Product Change Notice

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 09-Feb-2006 - Product Change Notice

PCN - 01-Dec-2005 - Product Change Notice

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 08-Mar-2007 - Product Change Notice

PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 06-Mar-2006 - Product Change Notice

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. See alternative
Different product options available. See alternative
Different packaging options available. See alternative
Possible Replacement options available. See alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

In Stock: 230

Can Ship immediately

MOQ for In Stock Qty:

MOQ for out of Stock Qty:

Factory Lead-Time:

6 Weeks can ship 6/18/26

Price (USD)

Qty

Unit Price

$23.10

$23.05

$22.99

$22.93

$14.11

120

$11.17

160 +

$10.95

Suppliers Standard Package

PIC16LF877-04I/PT

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

PIC16LF877-04I/PT

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

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