DSPIC30F5015-30I/PT by microchip technology

Image is representational - see mfr. specs

DSPIC30F5015-30I/PT

Name: DSPIC30F5015-30I/PT
Brand: Microchip Technology
SKU: 44795721
Price: 48.5 USD
Availability: InStock

Microchip Technology

MCU - 16-bit dsPIC RISC - 66KB Flash - 2KB SRAM - 1KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 80-Pin TQFP - Tray

Datasheet Accessories Notify Me

RoHS Compliant

TRAY Packaging

Certificate of Compliance Guarantee

This product may require extra documentation. Shipping may be delayed 1-2 days.

Description +

MCU - 16-bit dsPIC RISC - 66KB Flash - 2KB SRAM - 1KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 80-Pin TQFP - Tray

Search Keywords: DSPIC30F501530IPT

SPECS +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
Supplier:

Microchip Technology
Part No:

DSPIC30F5015-30I/PT
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8542310020
COO:

TH
ECCN:

3A991.a.2
Supplier Standard Pack:

8000
Program Memory Type:

Flash
RAM Size:

2 KB
Program Memory Size:

66 KB
Number of Programmable I/Os:

52
Operating Temperature:

-40 to 85 °C
ADC Resolution:

10 bit

Tools/3D Models +

EE ToolBox

Product Guides +

Datasheet

Product Changes +

PCN - 12-Dec-2005 - Product Change Notice

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 16-Aug-2011 - Data Sheet-Dspic30F5015/5016 Data Sheet

PCN - 11-Aug-2011 - Microchip Has Released A New Devicedoc For The Listed Dspic30F5015/5016 Data Sheet Of Devices.

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 11-Nov-2004 - Product Change Notice

PCN - 01-Dec-2005 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. See alternative
Different product options available. See alternative
Different packaging options available. See alternative
Possible Replacement options available. See alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

In Stock: 375

Ships today, if you order in

MOQ for In Stock Qty:

MOQ for out of Stock Qty:

2000

Factory Lead-Time:

5 Weeks can ship 7/16/26

Price (USD)

Qty

Unit Price

$9.70

500

$8.66

1,000

$8.64

2,000

$8.62

4,000

$8.59

6,000

$8.57

8,000 +

$8.55

Suppliers Standard Package

DSPIC30F5015-30I/PT

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

DSPIC30F5015-30I/PT

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

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