25LC1024-E/SM

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• EE ToolBox
  

• Datasheet

• PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

• PCN - 30-Aug-2013 - PCN REVISED: REMOVED DEVICES FROM THE FINAL NOTIFICATION

• PCN - 06-Mar-2006 - Product Change Notice

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 24-May-2010 - Data Sheet-25Lc1024 1 Mbit Spi Bus Serial Eeprom Data Sheet

• PCN - 15-Jun-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

• PCN - 24-May-2010 - Microchip Has Released A New Devicedoc For The 25Lc1024 1 Mbit Spi Bus Serial Eeprom Data Sheet Of D

• PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

• PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an

• PCN - 04-Apr-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

• PCN - 07-Oct-2005 - Product Change Notice

• PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 30-Aug-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

• PCN - 30-May-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD

• PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

• PCN - 30-May-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 31-Dec-2010 - QUALIFICATION OF 8L SOIJ PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and

• PCN - 04-Mar-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE