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MDM-9SSP-A30
ITT CANNON
Conn Micro D-Subminiature SKT 9 POS Solder Pot ST Panel Mount 9 Terminal 1 Port
Datasheet Accessories Notify Me
RoHS Compliant
Certificate of Compliance Guarantee
Description
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Conn Micro D-Subminiature SKT 9 POS Solder Pot ST Panel Mount 9 Terminal 1 Port
Search Keywords: MDM9SSPA30
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:ITT CANNON
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Part No:MDM-9SSP-A30
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Unit of Measure:Per Each
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RoHS:Yes
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COO:MX
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Supplier Standard Pack:
1 -
Moisture Resistance:Insulator resistance > 100 megohms
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Shell Finish:Black Anodize
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Insulator Resistance:5000 megohms min.
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Durability Rating:500 cycles of mating and unmating, 500 CPH max.
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Termination Type:Solder pot to accept #26AWG max. harness wire
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Contact Resistance:8 milliohms max.
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Hardware:Jackpost (standard)
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Coupling:Jackscrew Coupling
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Saltspray:48 hours
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Disclaimer:Our facility is not currently certified by the DLA and this product is not covered by the QPL/QML.
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Gender:Socket
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Thermal Shock:-55°/+125 °
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Arrangement:9 Contact
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Series:Micro "D" Metal Shell
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Shell Material:Aluminum
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Contact Type:Solder Pot
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Vibration:20Gs, 10-2000 Hz. 12 hours
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Dielectric Withstanding Voltage:600 VAC at sea level 150 VAC at 70,00 altitude
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Contact Material:gold plated copper alloy
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Insulator Material:contact size 9 to100 = liquid crystalline polymer, contact arrangements 7C2 or 24C4 = Diallyl phthalate
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Physical Shock:50 Gs, 3 axes, 6 milisecond duration sawtooth pulse
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Current Rating:3 A max.
Tools/3D Models
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Product Guides
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Datasheet
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
3
38 Weeks
can ship
1/21/27
Price (USD)
Qty
Unit Price
3
$472.03
5
$348.58
8
$258.71
10 +
$253.53
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