7717-153DAPG

Boyd Laconia LLC

Heat Sinks Semiconductor Pad for TO-18, DAP, 4 Leads, 6.35mm Outer Diameter, 0.97mm Thick

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RoHS Compliant
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Description +
Heat Sinks Semiconductor Pad for TO-18, DAP, 4 Leads, 6.35mm Outer Diameter, 0.97mm Thick
Search Keywords: 7717153DAPG
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    7717-153DAPG
  • Alias/AKA:
    034853
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    750
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We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
MOQ for out of Stock Qty:
3750
Order Increment:
750
16 Weeks can ship 8/17/26
Backorder
Price (USD)
Qty
Unit Price
3,750
$0.3224
7,500
$0.1984
11,250
$0.1571
15,000 +
$0.1539
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