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Image is representational - see mfr. specs
513202B02500G
Boyd Laconia LLC
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices ...
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Description
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The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices.
Search Keywords: 513202B02500G
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:513202B02500G
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Alias/AKA:041497
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8473305100
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COO:IN
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ECCN:EAR99
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Supplier Standard Pack:
1000 -
Device Cooled:TO-2206707
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Attachment Method:Solder Pin6706
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Dimension:34.92 x 12.7 x 50.86714mm
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Thermal Resistance:96717°C/W
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Finish:Black Anodized6710
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In Stock: 0
Minimum Order Quantity:
5
8 Weeks
can ship
6/29/26
Price (USD)
Qty
Unit Price
5
$6.76
25
$5.67
100
$5.24
250
$5.02
500
$4.81
1,000
$4.68
3,000
$4.50
5,000 +
$4.49
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