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375424B00034G by boyd laconia llc
Image is representational - see manufacturer specifications

Boyd Laconia LLC Authorized Distributor

375424B00034G

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description +
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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SPECS +
Product Attribute Attribute Value Select Attribute
Supplier: Boyd Laconia LLC
Part No: 375424B00034G
Alias/AKA: 042987
Unit of Measure: Per Each
RoHS: Yes
HTS: 8542900000
COO: CN
ECCN: EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution. 3360
Device Cooled: BGA6707,FPGA6707
Attachment Method: Tape6706
Dimension: 15.2 x 15.2 x 6.356714mm
Thermal Resistance: 62.56717°C/W
Finish: Black Anodized6710
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Frequently Asked Questions
Is 375424B00034G RoHS compliant?
Yes, 375424B00034G is RoHS compliant.
What is the lead time for 375424B00034G?
The standard lead time for 375424B00034G is approximately 6 weeks. In-stock quantities ship from OnlineComponents.com.
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We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 2,907
Ships today, if you order in
MOQ for In Stock Qty:
25
MOQ for out of Stock Qty:
840
6 Weeks can ship 12/22/26
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Price (USD)
Qty
Unit Price
25
$1.216
250
$1.002
500
$0.919
840
$0.910
1,680
$0.908
2,520
$0.906
3,360 +
$0.852
Supplier's Standard Package
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