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Image is representational - see mfr. specs
375424B00034G
Boyd Laconia LLC
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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Description
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:375424B00034G
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Alias/AKA:042987
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
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In Stock:
334
Ships today, if you order in
On Order:
3,360
can ship 6/11/26
Minimum Order Quantity:
25
6 Weeks
can ship
6/12/26
Price (USD)
Qty
Unit Price
25
$1.121
250
$0.821
500
$0.778
1,000
$0.771
3,360
$0.767
6,720
$0.763
10,080
$0.759
16,800 +
$0.755
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