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- 375424B00034G
Boyd Laconia LLC
375424B00034G
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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| Product Attribute | Attribute Value Select Attribute |
|---|---|
| Supplier: | Boyd Laconia LLC |
| Part No: | 375424B00034G |
| Alias/AKA: | 042987 |
| Unit of Measure: | Per Each |
| RoHS: | Yes |
| HTS: | 8542900000 |
| COO: | CN |
| ECCN: | EAR99 |
Supplier's Standard Package:
|
3360 |
| Device Cooled: | BGA6707,FPGA6707 |
| Attachment Method: | Tape6706 |
| Dimension: | 15.2 x 15.2 x 6.356714mm |
| Thermal Resistance: | 62.56717°C/W |
| Finish: | Black Anodized6710 |