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Image is representational - see mfr. specs
375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Datasheet Accessories Notify Me
RoHS Compliant
Bulk Packaging
Certificate of Compliance Guarantee
Description
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:375324B00035G
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Alias/AKA:035731
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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EE ToolBox
Product Guides
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Datasheet
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
3,316
Can Ship immediately
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
9 Weeks
can ship
7/6/26
Price (USD)
Qty
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
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