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Image is representational - see mfr. specs
374624B00032G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized
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RoHS Compliant
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Description
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized
Search Keywords: 374624B00032G
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:374624B00032G
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Alias/AKA:043181
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8419505000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
510 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:35 x 35 x 106714mm
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Thermal Resistance:23.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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Datasheet
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
769
Ships today, if you order in
Minimum Order Quantity:
10
6 Weeks
can ship
6/15/26
Price (USD)
Qty
Unit Price
10
$2.45
50
$2.23
250
$2.14
510
$2.10
1,020
$2.05
2,550
$1.98
5,100
$1.95
7,650 +
$1.94
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