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043181
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized
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RoHS Compliant
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Description
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized
Search Keywords: 043181
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:043181
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Alias/AKA:374624B00032G
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8419505000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
510
Product Guides
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
769
Ships today, if you order in
Minimum Order Quantity:
10
6 Weeks
can ship
6/9/26
Price (USD)
Qty
Unit Price
10
$2.45
50
$2.23
250
$2.14
510
$2.10
1,020
$2.05
2,550
$1.98
5,100
$1.95
7,650 +
$1.94
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