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042987 by boyd laconia llc
Image is representational - see mfr. specs

042987

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5A°C/W Black Anodized

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Datasheet Accessories Notify Me

RoHS Compliant
Packaging
Certificate of Compliance Guarantee
Description +
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5A°C/W Black Anodized
Search Keywords: 042987
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    042987
  • Alias/AKA:
    375424B00034G
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
Tools/3D Models +
Product Guides +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 446
Can Ship immediately
On Order:
3,360   can ship 6/5/26
Minimum Order Quantity:
25
6 Weeks can ship 6/9/26
ADD TO CART
Price (USD)
Qty
Unit Price
25
$1.121
250
$0.821
500
$0.778
1,000
$0.771
3,360
$0.767
6,720
$0.763
10,080
$0.759
16,800 +
$0.755
Suppliers Standard Package
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