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035731
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
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RoHS Compliant
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Description
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 035731
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:035731
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Alias/AKA:375324B00035G
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Unit of Measure:Per Each
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RoHS:Yes
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
1
Product Guides
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
3,316
Ships today, if you order in
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
9 Weeks
can ship
7/1/26
Price (USD)
Qty
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
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