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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized

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Description +
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 035731
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    035731
  • Alias/AKA:
    375324B00035G
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
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In Stock: 3,316
Ships today, if you order in
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
9 Weeks can ship 7/1/26
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Price (USD)
Qty
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
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