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44769-0802 by Molex / Waldom
Image is representational - see mfr. specs
Molex / Waldom

44769-0802

Molex / Waldom

Conn Wire to Board RCP 8 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray

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  • RoHS Compliant
  • Package Type: TRAY Packaging TRAY Packaging
  • CofC Guarantee

Datasheet | |

  • Product Attribute
    Attribute Value Select Attribute
  • Products found: 0
  • Supplier:
    Molex / Waldom
  • Part No:
    44769-0802
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Type:
    Wire to Board
  • Body Orientation:
    Straight
  • Gender:
    RCP
  • Mounting:
    Through Hole
  • Pitch:
    3 mm
  • Number of Contacts:
    8
  • Maximum Voltage Rating:
    250 V
  • Maximum Current Rating:
    5/Contact A
  • Termination Method:
    Solder
  • Operating Temperature:
    -40 to 105 °C
  • Conn Wire to Board RCP 8 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
    Search Keywords: 447690802
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In Stock: 2,420
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Factory Lead-Time:
can ship

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Quantity
Unit Price
30
€2.668
150
€2.554
300
€2.503
600
€2.472
3,240
€2.421
5,000
€2.101
10,000 +
€1.988

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