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Image is representational - see mfr. specs
44764-0801
Molex / Waldom
Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Datasheet Accessories Notify Me
RoHS Compliant
Tray Packaging
Description
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Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Search Keywords: 447640801
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Molex / Waldom
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Part No:44764-0801
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8536694040
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COO:US
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ECCN:EAR99
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Supplier Standard Pack:
1 -
Type:Wire to Board
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Body Orientation:Right Angle
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Gender:RCP
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Mounting:Through Hole
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Pitch:3 mm
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Number of Contacts:8
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Maximum Voltage Rating:600 V
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Maximum Current Rating:5/Contact A
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Termination Method:Solder
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Operating Temperature:-40 to 105 °C
Tools/3D Models
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EE ToolBox
Datasheet
Re-packaging information for part numbers with -C, -E, -P, - V suffixes
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
Minimum Order Quantity:
30
17 Weeks
can ship
9/7/26
Price (USD)
Qty
Unit Price
30
$2.49
150
$2.46
300
$2.42
600
$2.37
1,040
$2.33
4,000
$2.04
10,000 +
$1.98
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