English
Chinese
Italiano
Portuguese
Deutschland
French
Russian
Japanese
Turkish
Korean
Spanish
Image is representational - see mfr. specs
44067-2001
Molex / Waldom
3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating
Datasheet Accessories Notify Me
RoHS Compliant
Tray Packaging
Description
+
3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating
Search Keywords: 440672001
SPECS
+
-
Product AttributeAttribute Value Select Attribute
-
Supplier:Molex / Waldom
-
Part No:44067-2001
-
Unit of Measure:Per Each
-
RoHS:Yes
-
HTS:8536694040
-
COO:MX
-
ECCN:EAR99
-
Supplier Standard Pack:
1
Tools/3D Models
+
-
EE ToolBox
Datasheet
Re-packaging information for part numbers with -C, -E, -P, - V suffixes
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
582
Can Ship immediately
Minimum Order Quantity:
20
23 Weeks
can ship
10/19/26
Price (USD)
Qty
Unit Price
20
$3.93
85
$3.85
200
$3.78
350 +
$3.70
Click for Quote
Log in
to unlock special pricing