Home ›
All Products›
Integrated Circuits - ICs ›
Embedded ›
Microcontrollers ›
PIC18F2420T-I/SO

Available Replacements

Alternative Packaging

PIC18F2420-I/SO

Microchip Technology

In Stock: 433

Minimum Order: 27

VIEW PRODUCT

PIC18F2420T-I/SO by microchip technology

Image is representational - see mfr. specs

PIC18F2420T-I/SO

Microchip Technology

MCU - 8 Bit - Flash - PIC18 Family PIC18F24xx Series Microcontrollers - 40 MHz - 16 KB - 768 Byte - 28 Pins.

Datasheet Accessories Notify Me

RoHS Compliant

REEL Packaging

Certificate of Compliance Guarantee

This product may require extra documentation. Shipping may be delayed 1-2 days.

Description +

MCU - 8 Bit - Flash - PIC18 Family PIC18F24xx Series Microcontrollers - 40 MHz - 16 KB - 768 Byte - 28 Pins.

Search Keywords: PIC18F2420TISO

SPECS +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
Supplier:

Microchip Technology
Part No:

PIC18F2420T-I/SO
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8542310015
COO:

TH
ECCN:

3A991.a.2
Reel Pack:

1600

Tools/3D Models +

EE ToolBox

Product Guides +

Datasheet

Product Changes +

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 31-May-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 28-Jun-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 28-Feb-2011 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 18-Jan-2011 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 01-Apr-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. See alternative
Different product options available. See alternative
Different packaging options available. See alternative
Possible Replacement options available. See alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

In Stock: 780

Can Ship immediately

Manufacturer Stock:

12 can ship 5/25/26

MOQ for In Stock Qty:

MOQ for out of Stock Qty:

400

Factory Lead-Time:

5 Weeks can ship 6/15/26

Price (USD)

Qty

Unit Price

$5.25

100

$5.20

250

$5.19

400

$5.17

800

$5.16

1,200

$5.15

1,600 +

$5.06

Reel Package

PIC18F2420T-I/SO

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

PIC18F2420T-I/SO

Microchip Technology

Price (USD)

Standard Packaging

Reel Packaging

Join the circuit, Keeping You Connected to OnlineComponents.com & Beyond!