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513202B02500G by boyd laconia llc
Image is representational - see manufacturer specifications

Boyd Laconia LLC Authorized Distributor

513202B02500G

The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices ...

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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description +
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices.
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SPECS +
Product Attribute Attribute Value Select Attribute
Supplier: Boyd Laconia LLC
Part No: 513202B02500G
Alias/AKA: 041497
Unit of Measure: Per Each
RoHS: Yes
HTS: 8473305100
COO: IN
ECCN: EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution. 1000
Device Cooled: TO-2206707
Attachment Method: Solder Pin6706
Dimension: 34.92 x 12.7 x 50.86714mm
Thermal Resistance: 96717°C/W
Finish: Black Anodized6710
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Frequently Asked Questions
Is 513202B02500G RoHS compliant?
Yes, 513202B02500G is RoHS compliant.
What is the lead time for 513202B02500G?
The standard lead time for 513202B02500G is approximately 8 weeks. In-stock quantities ship from OnlineComponents.com.
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
Minimum Order Quantity:
5
8 Weeks can ship 12/29/26
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Price (USD)
Qty
Unit Price
5
$6.76
25
$5.67
100
$5.24
250
$5.02
500
$4.81
1,000
$4.68
3,000
$4.50
5,000 +
$4.49
Supplier's Standard Package
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