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513202B02500G by boyd laconia llc
Image is representational - see manufacturer specifications

Boyd Laconia LLC Authorized Distributor

513202B02500G

The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices ...

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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description +
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices.
Search Keywords: 513202B02500G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    513202B02500G
  • Alias/AKA:
    041497
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8473305100
  • COO:
    IN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1000
  • Device Cooled:
    TO-2206707
  • Attachment Method:
    Solder Pin6706
  • Dimension:
    34.92 x 12.7 x 50.86714mm
  • Thermal Resistance:
    96717°C/W
  • Finish:
    Black Anodized6710
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Frequently Asked Questions
Is 513202B02500G RoHS compliant?
Yes, 513202B02500G is RoHS compliant.
What is the lead time for 513202B02500G?
The standard lead time for 513202B02500G is approximately 8 weeks. In-stock quantities ship from OnlineComponents.com.
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
Minimum Order Quantity:
5
8 Weeks can ship 11/24/26
Backorder
Price (USD)
Qty
Unit Price
5
$6.76
25
$5.67
100
$5.24
250
$5.02
500
$4.81
1,000
$4.68
3,000
$4.50
5,000 +
$4.49
Supplier's Standard Package
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