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Image is representational - see manufacturer specifications
Boyd Laconia LLC
375424B00034G
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
SPECS
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Product AttributeAttribute Value Select Attribute
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Supplier:Boyd Laconia LLC
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Part No:375424B00034G
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Alias/AKA:042987
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Unit of Measure:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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Product Guides
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Datasheet
Frequently Asked Questions
Is 375424B00034G RoHS compliant?
Yes, 375424B00034G is RoHS compliant.
What is the lead time for 375424B00034G?
The standard lead time for 375424B00034G is approximately 6 weeks. In-stock quantities ship from OnlineComponents.com.
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock:
3,654
Can Ship immediately
MOQ for In Stock Qty:
25
MOQ for out of Stock Qty:
840
6 Weeks
can ship
10/26/26
Price (USD)
Qty
Unit Price
25
$1.093
250
$0.861
500
$0.818
840
$0.810
1,680
$0.808
2,520
$0.806
3,360 +
$0.804
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