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374724B60024G by boyd laconia llc
Image is representational - see mfr. specs

374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

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Datasheet Accessories Notify Me

RoHS Compliant
Packaging
Certificate of Compliance Guarantee
Description +
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized
Search Keywords: 374724B60024G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    374724B60024G
  • Alias/AKA:
    306220
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    168
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Solder Anchor6706
  • Dimension:
    35 x 35 x 186714mm
  • Thermal Resistance:
    15.36717°C/W
  • Finish:
    Black Anodized6710
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Product Guides +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 1,682
Can Ship immediately
Minimum Order:
5
6 Weeks can ship 1/2/26
ADD TO CART
Price (USD)
Qty
Unit Price
5
$5.70
50
$4.92
168
$4.55
336
$4.53
504
$4.51
1,008
$4.48
2,520
$4.46
5,040 +
$4.44
Suppliers Standard Package
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