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Image is representational - see mfr. specs
375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Datenblatt Zubehör Notify Me
RoHS-konform
Bulk Verpackung
Certificate of Compliance Guarantee
Beschreibung
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
Spezifizierung
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Product AttributeAttribute Value Select Attribute
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Lieferant:Boyd Laconia LLC
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Artikelnummer:375324B00035G
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Alias/AKA:035731
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Maßeinheit:Per Each
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RoHS (Beschränkung gefährlicher Stoffe):Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Standardmenge:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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EE-WERKZEUGKASTEN
Ressourcen
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Datenblatt
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
Vorrätig:
3,316
Versand heute, if you order in
MOQ für In-Stock-Menge:
5
MOQ für Out-of-Stock-Menge:
480
9 Weeks
Kan verzenden
30/7/26
PRICE (EUR)
MENGE
Stückpreis
5
€6.888
100
€4.295
250
€4.063
480
€3.886
960
€3.785
1 440
€3.712
1 920 +
€3.686
Click for Quote
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