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PRODUCT INFO
SP/1608FF-250MA by BUSSMANN / EATON
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SP/1608FF-250MA

Bussmann / Eaton

Fuse Chip 0.25A 24V SMD Solder Pad 0603

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43 can ship today
In our stock 
More available to ship 4/17/17
Manufacturer’s Lead Time 
Ships From: Phoenix, AZ
In Stock quantities placed in the next
11 hour(s) 13 minute(s) ship today!
RESOURCES
SPECS
Supplier: Bussmann / Eaton
Part No: SP/1608FF-250MA
RoHS: Unknown
Type: Chip
Maximum AC Voltage Rating: N/A
Maximum DC Voltage Rating: 24 V
Fuse Material: N/A
Packaging: N/A
Screening Level: N/A
Current Rating: 0.25 A
Maximum Power Dissipation: N/A
Mounting: Surface Mount
Acting: N/A
Operating Temperature: N/A
Dimension: 1.6 x 0.81 x 0.81mm
Fuse Size: 1.6 X 0.81 X 0.81mm
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DESCRIPTION
Fuse Chip 0.25A 24V SMD Solder Pad 0603
PART CLASSIFICATION DATA
ECCN: EAR99
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