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Image is representational - see mfr. specs
593202B03500G
Boyd Laconia LLC
The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor ...
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Descrição
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The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
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especificação
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Product AttributeAttribute Value Select Attribute
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fornecedor:Boyd Laconia LLC
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Número do item:593202B03500G
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Alias/AKA:042686
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Unidade de medida:Per Each
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RoHS:Yes
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HTS:8473309000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack::
800 -
Device Cooled:TO-220
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Attachment Method:N/A
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Dimension:35.05 x 12.2 x 50.8mm
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Thermal Resistance:10.4 °C/W
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Finish:Black Anodized
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em estoque:
835
Ships today, if you order in
No pedido:
8 000
Pode enviar 28/5/26
MOQ para qtd. em estoque:
5
MOQ para qtd. fora de estoque:
400
13 Weeks
Pode enviar
30/7/26
PRICE (USD)
QTD
Unit Price
5
$2.776
100
$0.708
250
$0.694
400
$0.667
800
$0.649
1 200
$0.646
1 600 +
$0.642
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