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Image is representational - see mfr. specs
375424B00034G
Boyd Laconia LLC
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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Descrição
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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especificação
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Product AttributeAttribute Value Select Attribute
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fornecedor:Boyd Laconia LLC
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Número do item:375424B00034G
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Alias/AKA:042987
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Unidade de medida:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack::
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
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em estoque:
3,694
Ships today, if you order in
Minimum Order Quantity:
25
6 Weeks
Pode enviar
3/7/26
PRICE (USD)
QTD
Unit Price
25
$1.148
250
$0.861
500
$0.818
1 000
$0.810
3 360
$0.808
6 720
$0.806
10 080
$0.804
16 800 +
$0.802
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