BCN318SB473J7 BI TECHNOLOGIES | Resistor Networks & Arrays
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BCN318SB473J7 by BI TECHNOLOGIES
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BCN318SB473J7

BI Technologies

Res Thick Film Array 47K Ohm 5% 0.5W(1/2W) ±200ppm/°C BUS Molded 10-Pin 2512(8 X 1206) Convex SMD T/R

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500 Ships 10/23/2017
In our stock This is the quantity we have on-hand in our inventory for immediate shipment.
More available to ship 12/11/17
Manufacturer’s Lead Time This is the manufacturer’s timeline for additional quantities placed with onlinecomponents.com.
Ships From: Phoenix, AZ
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SPECS
Supplier: BI Technologies
Part No: BCN318SB473J7
RoHS: Yes
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. <b>Minimum Order Quantities</b> and <b>Required Order Multiples</b> are presented with our price and availability information. 4,000
Circuit Designator: BUS
Type: Array
Package/Case: 2512(8 X 1206)
Family: BCN
Tolerance: 5 %
Number of Terminals: 10
Number of Resistors: 8
Resistance Value: 47 KOhm
Packaging: Tape and Reel
Termination Style: Convex
Temperature Coefficient: ±200 ppm/°C
Terminal Pitch: 1.27 mm
Product Weight: N/A
Mounting: Surface Mount
Case Size: 2512
Power Rating: 0.5 (1/2) W
Power Rating per Resistor: 0.063 (1/16) W
Technology: Thick Film
Operating Temperature: -55 to 155 °C
Dimension: 6.4 x 3.1 x 0.55 mm
Military Standard: N/R
Package Type: SMD
Failure Rate: N/R
Case Style: Molded
Case Size per Element: 1206
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DESCRIPTION
Res Thick Film Array 47K Ohm 5% 0.5W(1/2W) ±200ppm/°C BUS Molded 10-Pin 2512(8 X 1206) Convex SMD T/R
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PART CLASSIFICATION DATA
HTS: 8533210025
COO: JP
ECCN: EAR99