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PRODUCT INFO
898-1-R56 by BI TECHNOLOGIES
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898-1-R56

BI Technologies

Res Thick Film NET 56 Ohm 2% 2W ±250ppm/°C BUS Molded 16-Pin DIP Pin Thru-Hole Magazine Pack

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RESOURCES
SPECS
Supplier: BI Technologies
Part No: 898-1-R56
RoHS: Yes
Circuit Designator: BUS
Family: 898
Tolerance: 2 %
Number of Terminals: 16
Number of Resistors: 15
Resistance Value: 56 Ohm
Packaging: Magazine Pack
Termination Style: Pin
Temperature Coefficient: ±250 ppm/°C
Terminal Pitch: 2.54 mm
Mounting: Through Hole
Case Size: N/R
Power Rating: 2 W
Power Rating per Resistor: 0.125 (1/8) W
Operating Temperature: -55 to 125 °C
Dimension: 22.4 x 8.64 x 3.18 mm
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DESCRIPTION
Res Thick Film NET 56 Ohm 2% 2W ±250ppm/°C BUS Molded 16-Pin DIP Pin Thru-Hole Magazine Pack
PART CLASSIFICATION DATA
HTS: 8533210060
ECCN: EAR99
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